Friday, 24 July, 2026
Securing AI Bottlenecks: Nvidia and Amkor Seal $1.5 Billion U.S. Chip Packaging Deal
By TechShots Studio
Nvidia has signed a $1.5 billion multi-year capacity agreement with semiconductor assembly giant Amkor Technology. Powered by an advance payment from Nvidia, the deal expands domestic advanced chip packaging and testing facilities in Peoria, Arizona. This strategic expansion aims to strengthen U.S. AI supply chains and ease severe production bottlenecks for next-generation hardware.
Read full story at CIO ECONOMIC TIMES