Tuesday, 31 March, 2026
Xiaomi Commits $6.9 Billion to Chip Design, Strengthening Semiconductor Capabilities
By Isha
Xiaomi plans to invest at least 50 billion yuan ($6.93 billion) over a decade, starting from 2021, to bolster its chip design capabilities, as announced by founder Lei Jun. The company has already allocated 13.5 billion yuan towards developing its advanced mobile chip, XringO1. Currently, Xiaomi's chip design unit employs over 2,500 professionals, underscoring its commitment to enhancing in-house semiconductor development.
Read full story at Economic Times